>This isn't accurate. A compression interface can have the same resistance as a soldered connection.
All the information I can find suggests that CAMM2 will have higher parasitic resistance and capacitance than a soldered connection. Do you have a source for this claim?
The issue isn't just reaching a certain speed, but doing it at the same power consumption.
>The modules take up approximately the same amount of space on the board as the chips themselves.
They do take up more space, as anyone can easily check. Modern laptop motherboards can be very small, so this is significant.
>DDR5 and LPDDR5 are nearly identical [...]
What I mean is that Apple isn't going to want to invest any resources in adding the option of external RAM just for the relatively tiny desktop market. It's not that it's technically difficult; it just doesn't make sense from a logistical point of view.
All the information I can find suggests that CAMM2 will have higher parasitic resistance and capacitance than a soldered connection. Do you have a source for this claim?
The issue isn't just reaching a certain speed, but doing it at the same power consumption.
>The modules take up approximately the same amount of space on the board as the chips themselves.
They do take up more space, as anyone can easily check. Modern laptop motherboards can be very small, so this is significant.
>DDR5 and LPDDR5 are nearly identical [...]
What I mean is that Apple isn't going to want to invest any resources in adding the option of external RAM just for the relatively tiny desktop market. It's not that it's technically difficult; it just doesn't make sense from a logistical point of view.