Intel already has a great value GPU. Everyone wants them to disrupt the game, destroy the product niches. It's general purpose compute performance is quite ass alas but maybe that doesn't matter for AI?
I'm not sure if there are higher capacity gddr6 & 7's rams to buy. I semi doubt you can add more without more channels, to some degree, but also, AMD just shipped R9700 based on rx9070 but with double the ram. But something like Strix Halo, an API with more lpddr channels could work. Word is that Strix Halo's 2027 successor Medusa Halo will go to 6 channels and it's hard to see a significant advantage without that win; the processing is already throughput constrained-ish and a leap on memory bandwidth will definitely be required. Dual channel 128b isn't enough!
There's also MRDIMMs standard, which multiplexes multiple chips. That promises a doubling of both capacity and throughout.
Apple's definitely done two brilliant costly things, by putting very wide (but not really fast) memory on package (Intel had dabbled in doing similar with regular width ram in consumer space a while ago with Lakefield). And then by tiling multiple cores together, making it so that if they had four perfect chips next to each other they could ship it as one. Incredibly brilliant maneuver to get fantastic yields, and to scale very big.
I'm not sure if there are higher capacity gddr6 & 7's rams to buy. I semi doubt you can add more without more channels, to some degree, but also, AMD just shipped R9700 based on rx9070 but with double the ram. But something like Strix Halo, an API with more lpddr channels could work. Word is that Strix Halo's 2027 successor Medusa Halo will go to 6 channels and it's hard to see a significant advantage without that win; the processing is already throughput constrained-ish and a leap on memory bandwidth will definitely be required. Dual channel 128b isn't enough!
There's also MRDIMMs standard, which multiplexes multiple chips. That promises a doubling of both capacity and throughout.
Apple's definitely done two brilliant costly things, by putting very wide (but not really fast) memory on package (Intel had dabbled in doing similar with regular width ram in consumer space a while ago with Lakefield). And then by tiling multiple cores together, making it so that if they had four perfect chips next to each other they could ship it as one. Incredibly brilliant maneuver to get fantastic yields, and to scale very big.