Relatively few consumer electronics use Intel chips. Even in the devices that do use Intel chips, it's one Intel CPU versus dozens of others.

TI's fabs are mainly focused on analog, so the requirements are a bit different. IIRC we have 3 130-65nm layers for digital in our mixed signal designs which is roughly on par with a the process technology Intel used in 2005.

The majority ICs used for products and such do not need bleeding edge node sizes.

True. That is part of the reason why only 3 of maybe 30-60 layers are that small.

Analog gets some signal integrity benefits from larger transistors, and often we have fairly large fets for low rdson and high voltage tolerance.